According to the design idea of advanced VCP equipment in plating industry, we have designed the experiment slot which can be applied to the thin board plate (0.020mm Core) and the plating of back plate and plate with high quality of HDI plating copper thickness control, Throwing Power of the back plate and high uniformity of MSAP/SAP electroplating . In 2018, 2 Installation and commissioning were completed in April. At present, many customers have evaluated and proofed the experimental potions.
At present, the technical specifications of the experimental trough are as follows:
1. Uses: can achieve FPC blind hole electroplating, HDI common and filling electroplating, MSAP and SAP electroplating; at the same time, it is suitable for evaluating the filtering capability and effect of C/F, filter core and so on.
2. Thickness (hanger design): PI Core Min 0.02mm; FR4 and BT Min0.03mm, backplane MAX 6.0mm:
3. Anode type: insoluble (Magneto, low consumption type); soluble (copper ball Cu-P);
4. Product size: long direction: MAX 350mm; short direction: MAX 300mm;
5. rectifier current: matching 0-6ASD current density;
6. electroplating tank adjustable variables: temperature, swing amplitude (5-10cm), rolling speed (0-2.0m/min), jet flow rate (10-200L/min), nozzle spacing (5-10cm), etc.
The opening of the experimental tank has laid a foundation for the development and application of electroplating water in the advanced PCB field, which enables us to provide a more flexible and representative type of data production for the customer's early pharmaceutical assessment and technical decision-making. To help customers find the most suitable electroplating products for themselves.
