MSAP D/F stripping chemical
1. Application
- it is applied to dry film removal after MSAP electroplating in MSAP process.
- it can deal with fine lines to L/S=20/20um lines.
- it is applied to HDI (similar loading board), FPC, packaging substrate and other products.
2. Advantage
--L/S = 20/20 micron m fine lines can deal with mass production;
It can peel the film at 45 centigrade at low temperature and reduce the Cost effectively.
- - the removal of membrane fluid is easy to control (pH and Amine analysis).
- it can be recharged in a continuous manner;
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